Micron precision cutting for semiconductor wafers
Achieving dimensional accuracy of ±0.001mm, solving challenges in wafer processing!
In the semiconductor industry, high dimensional accuracy and surface quality are required in wafer manufacturing. Particularly in the fine processing of wafers, even slight errors can significantly impact product performance. Our precision cutting process, which achieves a dimensional accuracy of ±0.001mm and a surface roughness of Rz 0.4μm, contributes to quality improvement in wafer manufacturing. 【Application Scenarios】 - Wafer transport jigs - Wafer polishing plates - Inspection jigs 【Effects of Implementation】 - Improved yield in the wafer manufacturing process - Enhanced product reliability - Stable supply of high-quality wafers
- Company：丸和機械
- Price：Other
